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Hot Chips 30: Intel Kaby Lake G
Rumors of Intel using discrete AMD GPUs go back to at least late 2016. It wasn’t until last November that they officially announced it. What Intel came up with is their current generation of Thin and...
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Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10-...
Early last week Intel hosted an architecture day. The event was quite unique. It took place at the late Robert Noyce’s one-time home in Los Altos. There is a lot of history in that house. It was said...
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Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021
Earlier this week Intel held an Investor Meeting. This is the first Intel Investor Meeting in over two years. Intel outlined its long-term process technology roadmap and plan of attack, including an...
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Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds...
Yesterday, ahead of SemiCon West, Intel held a small event for their packaging and assembly technologies. A number of engineering leaders from Intel’s Assembly/Test Technology Development (ATTD) and...
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DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet...
Earlier this week, DARPA hosted the second annual Electronics Resurgence Initiative (ERI) Summit. One of the interesting announcements that came out of the ERI Summit was a new partnership by Intel...
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Intel Stratix 10 DX Adds PCIe Gen 4.0, Cache Coherency: UPI As Stopgap
Extending cache coherency beyond CPUs has been a hot topic in the last few years. Most recently, the Compute Express Link (CXL) has been gaining the most steam. But CXL is designed to take advantage of...
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Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies
Earlier this week Intel unveiled the latest device in its Stratix 10 family – the Stratix 10 GX 10M. The new device features 10.2 million LEs making it the industry’s largest FPGA in production. Intel...
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OCP Makes a Push for an Open Chiplet Marketplace
Two major trends have been defining the future of silicon in the data center and edge for the coming decade. Specialized devices are becoming key to workload-intensive applications. In addition to...
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Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality
As the industry heads into the 2020s, advanced packaging will not only become a necessary tool for compensating for the diminishing benefits of process scaling, but they have the potential to provide...
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Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
Today Intel held its global Intel Accelerated event where the company revealed a detailed process and packaging technology roadmap for the next half-decade. At the event, the company outlined some of...
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